Case List Processing technology Etching Surface treatment Machining Ceramic processing Lamination Combined process Welding Materials Stainless steel Iron Copper Aluminum Silver Titanium Molybdenum Tungsten Other Products Separator Substrate Jig Mask Shim Stiffening plate・Plate Leadframe Bus bar/ Terminals Mesh Core・Gear Grid・Electrode Heat sink Encoder Probe Decorations Seal ring・Cap Heater Spring LTCC (Low Temperature Co-fired Ceramics) Welding Etching + Bonding (Thermocompression bonding, diffusion bonding) Lamination Etched products + adhesive processing Etching Photo etching process on Copper (Cu) Etching Heat sink Surface treatment Selective plating process Etching Etching or Bending Leadframe Surface treatment Plating on leadframes
