【What is a lead frame? 】

Lead frame is a metal component used in semiconductor packaging such as IC (integrated circuit) and LSI (large-scale integrated circuit).  It supports and fixes element (semiconductor chip) and connect them to external wiring.

The terminal part, which looks like multiple legs and appears outside of IC or LSI, is part of the lead frame.

In addition, it is often composed of a die pad that supports and fixes the semiconductor element, inner leads that connect the wiring to the semiconductor element, and outer leads that bridge the external wiring.

Lead frames are manufactured by stamping, or etching which is our specialty.

[Metal materials used for lead frames]

The metals used in lead frames for semiconductor are mainly Ni alloys (Kovar, Alloy 42) and copper alloys.

We always stock those materials in-house and can provide etching processing

We have various materials with different thickness, but materials which thickness are 0.1 ~ 0.5mmt are mostly requested for lead frame.

[Metal materials used for lead frames (Kovar)]

Kovar is the Ni alloy material that contains 29% nickel and 17% cobalt based on iron.

It is used as a material for lead frames since the coefficient of thermal expansion at room temperature is close to that of hard glass or ceramics.

[Metal materials used for lead frames (Alloy 42)]

Alloy 42 is the Ni alloy material that contains 42% nickel based on iron.

It is used as a material for lead frames since the coefficient of thermal expansion at room temperature is close to that of hard glass or ceramics.

[Metal materials used for lead frames (Copper alloy)]

Copper alloy which contains iron is used as a copper alloy material for the lead frame.

This material has excellent strength and conductivity.

Main copper alloy materials we use are C1940 (JIS) / C19400 (CDA) materials (Kobe Steel KLF194, Mitsubishi Materials TAMAC194) and C1921 (JIS) / C19210 (CDA) material (Kobe Steel KFC).

We can also confirm the availability of materials and processability if you request other copper alloys.

 [Processing method]

Etching processing is the process of replicating the shape by corrosion of metals.

Etching artwork photo tool is necessary for production. However, it can be produced inexpensively and suitable for prototype ~ medium mass production.

Etching does not apply large amount of heat or power during processing; therefore warpage does not occur easily.

Corner R becomes 50~80% of the material thickness, therefore it may not be suitable for the shape requiring sharp angle.

Dimensional accuracy is required about ±10~15% of the material thickness, therefore it may not be suitable for thicker materials.

Bending of the lead frame tip is available.

We have experiences of bending both unit and sheet.