Power semiconductor (power device) Etching process Fiber laser processing Wire EDM

【What is a Power semiconductor (Power device)?】

Power semiconductors (power devices) are capable of handling high currents and high voltages. In recent years, power semiconductors (power devices) have been attracting attention in terms of how to reduce the waste of electricity, as people become increasingly aware of energy conservation and power saving.

A wide variety of power semiconductors (power devices) are being developed for a wide range of applications, including smart phones, PCs, home appliances, automobiles, railroads, and power plants etc.

Power semiconductors that use large amounts of power generate heat and easily become hot, which may lead to failure.

“Heat sinks” that efficiently dissipate this heat are sometimes made by etching process.

【Power semiconductors (power devices) x Hirai Seimitsu Kogyo】

We mainly cooperate with leadframes and their heat sinks that support and fix chips of power semiconductors (power devices) and connect their wiring, as well as with jigs and metal masks used in manufacturing processes, etc.

We have a wide variety of materials from pure copper to copper alloys (TAMAC and KFC etc.), which can be etched for leadframes.

Even for shapes that are difficult to make by etching only , we can provide combined processing using etching and machining (Fiber laser machining and Wire EDM).

This is a processing technology that can take advantage of Hirai Seimitsu Kogyo, which possesses not only etching processing but also machining (laser processing and wire electrical discharge machining).

It is also possible to produce irregularly shaped leadframes by creating a step (concavity) by half etching and machining the outer shape (fiber laser machining, wire EDM).

For heat sinks, thick copper can be processed by Hirai Seimitsu Kogyo’s machining (fiber laser machining and wire EDM).

Also, for heat-dissipating materials (substrates) where copper and ceramics or copper and resin are bonded, only the copper portion can be etched to create a pattern.

Heat dissipating materials consisting of copper and ceramic or copper and resin may not be etched depending on their mutual adhesion to each other.

For jigs used in production processes, etc., jigs for transportation and bonding can be made by overlapping and joining (thermocompression bonding or laser welding) plates made by the etching process.

We can also produce metal masks used in production processes for sputtering and evaporation coating.

We have a wide variety of materials, from stainless steel to nickel alloys, as well as copper-based materials.